CNBC AI News, August 4th – Southchip today unveiled its second-generation automotive-grade High-Side Switch (HSD), the SC77450CQ.
The unveiling marks a significant step for Southchip, as the SC77450CQ leverages a vertically integrated BCD process developed in-house, coupled with a fully domestic supply chain for packaging and testing. This approach integrates MOSFETs and controllers on a single N-type substrate wafer, streamlining system development.
Southchip touts the SC77450CQ as a disruption to the current market landscape, asserting it is the first high-side switch product with a fully domestic supply chain utilizing vertically integrated technology. This positions the company as a potential challenger to existing overseas dominance in this sector.
For context, the vertical BCD integration process involves fabricating bipolar transistors (Bipolar), CMOS, DEMOS, LDMOS, and VDMOS on the same N-type silicon substrate, offering a monolithic approach.
Contrast this with a co-packaging approach, where power devices and control ICs are placed within the same package during the assembly phase, either side-by-side or stacked, and interconnected via wire bonds, maintaining physical separation.
Integrated processes, characterized by shared substrates and short interconnects, are particularly advantageous for high-side switches, but this technology has historically been dominated by foreign manufacturers.
Process architecture and key feature comparison. Left: Integrated process, Right: Co-packaging process
Co-packaging allows for the selection of the most mature domestic manufacturing processes for both the MOSFET and controller, and offers greater scalability in voltage ratings.
The SC77450CQ boasts a quad-channel smart high-side switch configuration with a low on-resistance of 50mΩ. It features a wide 4V-28V supply voltage range, a 40V load dump voltage withstand, and a low 0.5μA standby current. This positions it as a robust solution for demanding automotive applications.
Southchip High-Side Switch Product Family
The device supports high-precision current sensing, achieving a ±4% current detection accuracy at 2A. It utilizes an eSSOP-14 package with a thermal pad, offering pin compatibility with international competitors.
The SC77450CQ integrates comprehensive protection mechanisms and diagnostic capabilities, including overcurrent and short-to-ground self-shutdown, relative and absolute overtemperature protection, intelligent latch-off functionality, negative voltage clamping, open-load and short-to-battery detection in the off-state, ground loss and power loss protection, overvoltage and undervoltage protection. The device also provides a multiplexed analog signal output, providing real-time feedback of the load current on each channel.
High-side switches, power semiconductor devices crucial for control in automotive and industrial applications, integrate a power MOSFET, logic drive, and protection features to enable intelligent control of loads such as motors, lamps, and actuators. Southchip’s entrant promises to stir competition in this growing market.
Original article, Author: Tobias. If you wish to reprint this article, please indicate the source:https://aicnbc.com/6357.html
