CNBC AI News – August 10th – Huawei is poised to unveil a groundbreaking technological advancement in the realm of AI inference at the “2025 Financial AI Inference Application Landing and Development Forum” on August 12th, according to reports from domestic Chinese media.
The anticipated innovation is rumored to potentially reduce China’s AI inference reliance on High Bandwidth Memory (HBM) technology. This could significantly boost the performance of Chinese AI large language models during inference, and ultimately strengthen a critical component within the broader Chinese AI inference ecosystem.
HBM, or High Bandwidth Memory, is an advanced DRAM solution employing 3D stacking technology. This architecture vertically integrates multiple layers of DRAM chips, resulting in dramatically enhanced data transfer efficiency. Its advantages include ultra-high bandwidth, low latency, high capacity density, and superior energy efficiency.
AI inference demands the frequent retrieval of massive model parameters (think hundreds of billions of weights) and real-time input data. HBM’s high bandwidth and large capacity allow GPUs to directly access entire models, preventing the computational bottlenecks caused by insufficient bandwidth in traditional DDR memory. For models boasting hundreds of billions of parameters or more, HBM can demonstrably accelerate response times.
Currently, HBM has become virtually standard in high-end AI chips, boasting near-100% penetration in the training sector. Its adoption in inference is also rapidly accelerating as models grow in complexity.
However, constrained HBM production capacity and U.S. export restrictions are driving Chinese manufacturers to explore alternative strategies, including Chiplet packaging and low-parameter model optimization.
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