Chipmaking

Applied Materials (AMAT) introduced new chipmaking systems on Oct 7, 2025, designed to enhance AI chip performance. These include the Kinex™ bonding system for advanced logic and memory, the Xtera™ Epi system for Gate-All-Around transistors, and the PROVision™ 10 eBeam metrology system for improved yield in 3D chips. These innovations address critical areas like logic, DRAM, and advanced packaging, aiming to deliver performance and power-efficiency improvements needed to scale AI.

TSMC maintains that its advanced chipmaking roadmap, including the 1.4-nanometer (A14) process, doesn’t currently require High-NA EUV lithography. The company is prioritizing optimizing their existing EUV technology, achieving significant performance improvements using innovative designs like their second-generation nanosheet GAA, delaying the need for the costly high-NA systems. This strategy highlights TSMC’s focus on cost-effectiveness and technological innovation.