High-NA EUV
-
EUv High-NA Adoption Slows as Chipmakers Delay Implementation
Leading foundries are scaling back their reliance on ASML’s High-NA EUV lithography machines, delaying adoption due to unexpected demand softening and the rise of new transistor architectures like GAAFET. This has led some institutions to lower price targets for ASML. Despite short-term adjustments, ASML’s established EUV technology remains crucial for advanced chip manufacturing, and long-term prospects are bolstered by AI-driven demand.
-
ASML Hit Hard: TSMC’s Revelation Stuns, Only Five Advanced EUV Machines Sold
TSMC maintains that its advanced chipmaking roadmap, including the 1.4-nanometer (A14) process, doesn’t currently require High-NA EUV lithography. The company is prioritizing optimizing their existing EUV technology, achieving significant performance improvements using innovative designs like their second-generation nanosheet GAA, delaying the need for the costly high-NA systems. This strategy highlights TSMC’s focus on cost-effectiveness and technological innovation.
