Memory Packaging

SK Hynix broke ground on its first U.S. advanced memory packaging facility in Indiana, a $4 billion investment to bolster the AI semiconductor supply chain. The plant, set to be operational by October 2028, will focus on High Bandwidth Memory (HBM) packaging, crucial for AI performance. This strategic expansion aims to secure a domestic HBM supply, foster innovation, and create over 1,000 jobs, marking a significant step in the U.S. semiconductor re-shoring effort.