Metrology

Applied Materials (AMAT) introduced new chipmaking systems on Oct 7, 2025, designed to enhance AI chip performance. These include the Kinex™ bonding system for advanced logic and memory, the Xtera™ Epi system for Gate-All-Around transistors, and the PROVision™ 10 eBeam metrology system for improved yield in 3D chips. These innovations address critical areas like logic, DRAM, and advanced packaging, aiming to deliver performance and power-efficiency improvements needed to scale AI.