Chip Manufacturing

China’s semiconductor industry achieved a milestone with the rollout of the first domestically produced 28nm Critical Dimension Electron Beam Metrology equipment in Wuxi. Developed by Wuxi Gonsin Instruments, the CD-SEM features complete self-reliance in key components. This advancement addresses critical challenges in semiconductor metrology and inspection, filling a vital gap in China’s integrated circuit industry and enhancing self-sufficiency in high-end chip equipment. Gonsin aims to provide comprehensive CD-SEM solutions for diverse semiconductor manufacturing needs.

Intel launched a “USAI” section on its website, emphasizing its commitment to American chip manufacturing – claiming to be the only U.S. company manufacturing advanced chips domestically for over 50 years. This follows a meeting between Intel CEO Pat Gelsinger and President Trump, signaling a potential shift in sentiment. Facing global competition and scrutiny, Intel aims to solidify its standing as a vital American asset. Gelsinger addressed concerns about his background and assured the company is on track to advanced U.S. semiconductor manufacturing process.

Leading foundries are scaling back their reliance on ASML’s High-NA EUV lithography machines, delaying adoption due to unexpected demand softening and the rise of new transistor architectures like GAAFET. This has led some institutions to lower price targets for ASML. Despite short-term adjustments, ASML’s established EUV technology remains crucial for advanced chip manufacturing, and long-term prospects are bolstered by AI-driven demand.