Chip Packaging
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TSMC to Introduce New CoPoS Packaging by Late 2028, Nvidia Likely to be First Customer
TSMC is developing CoPoS, a next-gen chip packaging technology using large panel substrates (up to 310x310mm), expanding upon CoWoS. CoPoS, featuring an interposer for improved signal integrity, is slated for pilot production in 2026, mass production by late 2028/early 2029. It targets high-end applications needing robust power delivery, potentially replacing CoWoS-L, with NVIDIA likely as an early adopter. Interposer materials will move toward glass.
