Micron

Samsung’s 12-layer HBM3E memory is facing delays in obtaining NVIDIA certification, potentially pushing the timeline to Q4 2025. This setback for the tech giant, which previously aimed for earlier certification dates, could impact its market strategy and revenue. Meanwhile, competitors like Micron are poised to gain market share, as they are actively pursuing HBM3E opportunities, notably with NVIDIA’s GB300 project.

Micron has begun shipping samples of its 1γ LPDDR5X memory, targeting next-gen AI smartphones. This advanced, low-power DRAM boasts industry-leading 10.7Gbps speeds, up to 20% lower power consumption, and the thinnest packaging in the industry at 0.61mm. This marks a significant advancement in mobile memory, utilizing EUV lithography. Competitors like Samsung and SK Hynix are also developing their own 1c DRAM solutions, intensifying the competition in the mobile memory market.

The NAND flash market faced a tough Q1 2025, with a 15% ASP drop and 7% shipment decline due to inventory pressure and weak demand. The top five suppliers’ combined revenue fell nearly 24%. Samsung led, but revenue decreased by 25%. Micron rose to third despite ASP drops. Despite the downturn, a rebound of about 10% in sequential revenue is anticipated in Q2.