Mobile DRAM

SK hynix has begun shipping mobile DRAM featuring industry-first High-K EMC, significantly improving thermal management. This innovation boosts thermal conductivity by 3.5x and reduces thermal resistance by 47%, mitigating heat issues in on-device AI applications, where rising data transfer rates generate considerable heat. The breakthrough is achieved by incorporating Alumina into Silica-based EMC. SK hynix aims to lead in next-generation mobile DRAM through continued material innovation, enhancing performance and extending device lifespan.