- SK hynix pioneers High-K EMC material, boosting thermal conductivity by 3.5x and reducing thermal resistance by 47%.
- The innovation is anticipated to significantly mitigate heat issues in on-device AI applications.
- SK hynix aims to lead the next generation of mobile DRAM through advanced material technology.
SEOUL, South Korea – SK hynix Inc. has announced the commencement of shipments for its mobile DRAM featuring industry-first High-K Epoxy Molding Compound (EMC), a move poised to revolutionize thermal management in high-performance mobile devices.
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EMC (Epoxy Molding Compound) is a critical component in semiconductor packaging, shielding chips from environmental stressors like moisture, heat, impact, and electrical interference, while also facilitating heat dissipation. High-K EMC increases thermal conductivity by incorporating materials with superior heat transfer coefficients within the compound. |
This advancement comes at a crucial time, as the increasing demands of on-device AI accelerate data transfer rates, leading to significant heat generation that can throttle smartphone performance. Major smartphone manufacturers are optimistic that SK hynix’s new technology will be instrumental in addressing these thermal challenges in their flagship devices.
The prevalent Package on Package (PoP) architecture, where DRAM is vertically stacked on the application processor (AP), maximizes space efficiency and data transfer speed. However, this configuration can trap heat generated by the mobile AP within the DRAM, resulting in performance degradation.
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PoP (Package on Package) is a common packaging technique for mobile devices involving the vertical stacking of different chip types to enhance space utilization, performance, and combination flexibility. |
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Mobile AP (Application Processor) refers to the central processing unit in mobile devices like smartphones and tablets. |
SK hynix’s breakthrough stems from enhancing the thermal conductivity of EMC, a vital material encapsulating the DRAM package. The company achieved this by incorporating Alumina into the traditional Silica-based EMC, yielding the High-K EMC.
The High-K EMC delivers a 3.5-fold improvement in thermal conductivity and reduces vertical thermal resistance by 47%. This translates to potentially longer battery life and extended product lifespan due to enhanced smartphone performance and reduced power consumption, a win-win for consumers and manufacturers alike.
“This is more than a simple performance upgrade; it directly addresses a pain point for users of high-performance smartphones,” stated Lee Gyujei, Head of Package Product Development at SK hynix. “We are resolutely focused on solidifying our technological leadership in the next-generation mobile DRAM market through continuous material innovation.”
About SK hynix Inc.
SK hynix Inc., based in Korea, is a leading global semiconductor supplier, providing Dynamic Random Access Memory (DRAM) and flash memory (NAND flash) chips to a diverse range of customers worldwide. Shares of SK hynix are traded on the Korea Exchange, with Global Depository shares listed on the Luxembourg Stock Exchange.
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