Panel-Level Packaging

ACM Research (ACMR) announced the delivery of its first commercial panel electroplating tool, the Ultra ECP ap-p, on Nov 16, 2025. The system, designed for large panels, supports Cu, Ni, SnAg, and Au plating for pillar, bump, and RDL processes. Key features include high-speed Cu paddles for pillars >300 microns, a four-sided sealing chuck, in-cell rinse, and a horizontal design with a rotating square electrical field for uniform deposition. The system aims to improve scalability and reduce costs for advanced packaging.