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ACM Research (NASDAQ: ACMR) announced delivery of its first commercial panel electroplating tool, the Ultra ECP ap-p, to an industry-leading panel fabrication customer on Nov 16, 2025.
The system is described as the first commercial panel-level copper deposition platform for large panels, supporting Cu, Ni, SnAg and Au plating and plating steps for pillar, bump, and RDL processes. Key features include high-speed Cu paddles for pillars >300 microns, a four-sided sealing dry contact chuck, in-cell rinse to reduce cross-contamination, and a horizontal design with a rotating square electrical field for uniform deposition.
ACM Research (NASDAQ: ACMR) ha annunciato la consegna del suo primo strumento commerciale di elettrodeposizione su pannelli, il Ultra ECP ap-p, a un cliente di rilievo nel settore della produzione di pannelli il 16 novembre 2025.
Il sistema è descritto come la prima piattaforma commerciale di deposito di rame a livello pannello per grandi pannelli, supportando placcature di Cu, Ni, SnAg e Au e i relativi passaggi di placcatura per pilastri, bump e RDL. Le caratteristiche chiave includono palette Cu ad alta velocità per pilastri >300 micrometri, una pinza a contatto secco sigillata su quattro lati, risciacquo in-cell per ridurre la contaminazione crociata e un design orizzontale con un campo elettrico quadrato rotante per un deposito uniforme.
ACM Research (NASDAQ: ACMR) anunció la entrega de su primera herramienta comercial de electroplating de paneles, el Ultra ECP ap-p, a un cliente líder en fabricación de paneles el 16 de noviembre de 2025.
El sistema se describe como la primera plataforma comercial de deposición de cobre a nivel de panel para paneles grandes, que soporta galvanoplastias de Cu, Ni, SnAg y Au y pasos de recubrimiento para pilares, bumps y RDL. Entre sus características clave se incluyen paletas de Cu de alta velocidad para pilares >300 micras, un chuck de contacto seco sellado en cuatro lados, enjuague en-cell para reducir la contaminación cruzada y un diseño horizontal con un campo eléctrico cuadrado giratorio para un depósito uniforme.
ACM Research (NASDAQ: ACMR)이 2025년 11월 16일 업계 선도적 패널 제조 고객에게 첫 상용 패널 전해도금 도구인 Ultra ECP ap-p를 인도했다고 발표했습니다.
이 시스템은 대형 패널용 패널 수준의 구(deposited copper) 증착 플랫폼의 첫 상용 버전으로 설명되며, Cu, Ni, SnAg 및 Au 도금과 기둥, 범프 및 RDL 공정의 도금 단계들을 지원합니다. 주요 특징으로는 300마이크로미터를 초과하는 기둥용 고속 Cu 패들, 네 모서리 밀봉 건식 접촉 chuck, 교차 오염 감소를 위한 인셀 린스, 균일한 증착을 위한 회전하는 사각형 전기장의 수평 설계가 포함됩니다.
ACM Research (NASDAQ: ACMR) a annoncé la remise de son premier outil commercial d’électroplating sur panneau, le Ultra ECP ap-p, à un client leader dans la fabrication de panneaux le 16 novembre 2025.
Le système est décrit comme la première plateforme commerciale de dépôt de cuivre à l’échelle panneau pour les grands panneaux, prenant en charge le dépôt Cu, Ni, SnAg et Au et les étapes de dépôt pour les piliers, les bumps et le RDL. Les caractéristiques clés incluent des palettes Cu à grande vitesse pour les piliers >300 microns, un choc à contact sec et à scellage sur quatre côtés, un rinçage en-cell pour réduire la contamination croisée et un design horizontal avec un champ électrique carré rotatif pour un dépôt uniforme.
ACM Research (NASDAQ: ACMR) hat die Auslieferung seines ersten kommerziellen Panel-Elektroplattierwerkzeugs, dem Ultra ECP ap-p, an einen branchenführenden Panel-Fertigungs-Kunden am 16. November 2025 bekannt gegeben.
Das System wird als die erste kommerzielle Panel-Ebene Kupferabscheidungsplattform für große Panels beschrieben, die Cu-, Ni-, SnAg- und Au-Plattierungen sowie Plattierungsschritte für Säulen, Bumps und RDL-Prozesse unterstützt. Hauptmerkmale sind hochgeschwindigkeits Cu-Paddles für Säulen >300 Mikrometer, ein Vierseiten-Dichtsiegel-Dry-Contact-Chuck, ein In-Cell-Spülvorgang zur Reduzierung von Kreuzkontaminationen und ein horizontales Design mit einem rotierenden quadratischen elektrischen Feld für eine gleichmäßige Abscheidung.
ACM Research (NASDAQ: ACMR) أعلن عن تسليم أول أداة طلاء إلكترولي للمسامير على سطح لوحي تجاري، وهي Ultra ECP ap-p، إلى عميل رائد في تصنيع الألواح في 16 نوفمبر 2025.
يُوصف النظام بأنه أول منصة تجارية لإظهار النحاس على مستوى اللوحة للوحـات الكبيرة، تدعم عمليات الطلاء لـ Cu و Ni و SnAg و Au وخطوات الطلاء للعمود والنتوء وRDL. تشمل الميزات الرئيسية صوافي Cu عالية السرعة للأعمدة التي تتجاوز 300 ميكرون، ومخزون تشغيلي إحكامه جاف ذو ثلاثة أضلاع
Insights
ACM delivered its first horizontal panel electroplating tool, marking a commercial milestone for panel‑level packaging capacity and customer qualification.
ACM Research has shipped the Ultra ECP ap-p, described as the first commercial panel-level copper deposition system for the large-panel market, to an industry-leading panel fabrication customer on November 17, 2025. The system supports Cu, Ni, SnAg and Au plating and lists technical features—high-speed Cu paddles for pillar heights >300 microns, a four-sided sealing dry contact chuck, in-cell rinse, and a rotating square electrical field synchronized with a rotating chuck—that aim to deliver wafer-comparable uniformity for pillar, bump and RDL processes.
Benefits depend on customer adoption and yield performance during qualification. The shipment is a validation step but not proof of volume production or financial impact; risks include integration, yield, and multi-customer uptake. Watch customer qualification milestones, production ramp signals, and any volume purchase orders over the next 6–18 months for clearer commercial impact, and note the company is exhibiting at SEMICON Europa (November 18-21, 2025).
ACM’s Ultra ECP ap-p enables next generation device performance amid accelerating market demand for advanced packaging
SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) — ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced it has delivered the first panel electrochemical plating tool, the Ultra ECP ap-p, to an industry-leading panel fabrication customer. This achievement underscores ACM’s advancement in panel-level electroplating technology and reflects growing market demand for scalable, cost-efficient advanced packaging solutions to meet next generation device requirements.
The Ultra ECP ap-p is the first commercial panel-level copper deposition system for the large-panel market, supporting plating steps across pillar, bump, and redistribution layer (RDL) processes. The system achieves panel-processing performance – comparable to traditional round wafer processes, enabling manufacturers to meet demanding device requirements with greater efficiency.
“We are pleased to fulfill this order for our Ultra ECP ap-p,” said Dr. David Wang, ACM’s President and Chief Executive Officer. “This milestone demonstrates our ability to deliver high-performance horizontal panel electroplating solutions through our differentiated technology that help customers accelerate their fan-out panel-level packaging roadmaps while strengthening our role in the advanced packaging ecosystem. As demand grows for next-generation devices, panel-level packaging offers the scalability, throughput, and cost advantages needed for high-volume production, which will achieve a seamless transition for the industry from 300-millimeter wafer packaging to panel-level packaging.”
The system features ACM proprietary horizontal electroplating technology, and supports copper (Cu), nickel (Ni), tin-silver (SnAg) and a gold (Au) plating. The Cu plating chambers incorporate high-speed plating paddles specifically designed for tall pillar applications, capable of achieving pillar heights exceeding 300 microns. The Ultra ECP ap-p features a four-sided sealing dry contact chuck for improved reliability, in-cell rinse functionality to minimize chemical cross-contamination between different plating cells, and a horizontal electroplating design synchronizing a rotating square electrical field with the rotating chuck for superior deposition uniformity.
To truly grasp the significance, consider the evolving landscape of semiconductor packaging, particularly in high-performance computing and mobile applications. Advanced packaging techniques are no longer just about shrinking size; they’re about boosting performance, managing power efficiently, and increasing bandwidth. Fan-out panel-level packaging (FOPLP) is emerging as a key enabler, offering larger surface areas for components and improved thermal management compared to traditional wafer-level packaging. This allows for denser chip integration and superior electrical performance, crucial for demanding applications like AI and 5G.
ACM’s Ultra ECP ap-p directly addresses the need for precise and uniform electroplating in FOPLP. The ability to handle large panels and deposit various metals with high precision is critical for creating reliable and high-yielding advanced packages. The system’s features, such as the rotating square electrical field and in-cell rinse, highlight ACM’s focus on overcoming the challenges of panel-level electroplating, such as non-uniform deposition and cross-contamination.
While ACM highlights the potential for a seamless transition from 300mm wafer packaging, the adoption of panel-level packaging faces hurdles. Equipment costs, infrastructure readiness, and the development of standardized processes are key considerations. Furthermore, competition from established players in the wafer-level packaging market necessitates a compelling value proposition for panel-level solutions.
However, the potential rewards are significant. The scalability and cost-effectiveness of panel-level packaging can unlock new possibilities for advanced chip integration, particularly for applications where cost sensitivity is a major factor.
ACM’s move into panel-level electroplating is a strategic bet on the future of advanced packaging. The Ultra ECP ap-p represents a significant step towards realizing the potential of FOPLP, and its success could solidify ACM’s position as a key player in the semiconductor manufacturing equipment market. Investors will be closely watching customer adoption rates and the system’s impact on yield and throughput to gauge its long-term viability.
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.
© ACM Research, Inc. Ultra ECP ap-p and the ACM Research logo are trademarks of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
FAQ
What did ACM Research (ACMR) announce on November 16, 2025 about the Ultra ECP ap-p?
ACM announced delivery of its first commercial panel electroplating tool, the Ultra ECP ap-p, to an industry-leading panel fabrication customer.
Which plating chemistries does the ACMR Ultra ECP ap-p support?
The company says the Ultra ECP ap-p supports copper (Cu), nickel (Ni), tin-silver (SnAg) and gold (Au) plating.
What panel-processing capabilities does ACMR claim for the Ultra ECP ap-p?
ACM states the system supports pillar, bump and RDL plating with Cu paddles capable of pillar heights exceeding 300 microns and wafer-comparable performance.
When and where did ACM Research showcase the Ultra ECP ap-p?
ACM invited attendees to see the platform at SEMICON Europa, Nov 18–21, 2025, booth C1129 at Messe München.
How does ACMR describe the Ultra ECP ap-p’s design for deposition uniformity?
The company describes a horizontal electroplating design that synchronizes a rotating square electrical field with a rotating chuck for superior deposition uniformity.
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