semiconductor manufacturing

Nordson Electronics Solutions will showcase its latest semiconductor manufacturing innovations at SEMICON Taiwan 2025 (September 10-12, booth i2326). They will highlight automated fluid dispensing with the ASYMTEK® Vantage® system, featuring IntelliJet® jet valves for high-volume underfill and sealing applications. Experts will also discuss plasma treatment for impurity removal and surface preparation, bolstering semiconductor package reliability. Nordson’s brands offer solutions for fluid dispensing, conformal coating, plasma treatment, and selective soldering.

GlobalFoundries and Apple are expanding their partnership to advance semiconductor tech and bolster U.S. manufacturing. GF will manufacture wireless connectivity and power management chips for AI devices at its Malta, NY, facility. This builds on GF’s $16B investment in NY and VT sites, aligning with Apple’s $600B American Manufacturing Program pledge. The collaboration supports the push for domestic chip independence and AI leadership. This strategic move enhances GF’s position by focusing on specialized process technologies for next-gen devices.

TSMC faces pressure from potential U.S. tariffs and demands for significant investment. The U.S. is considering a 20% tariff on Taiwanese exports, prompting negotiation for a rate closer to South Korea and Japan’s 15%. Reports suggest the U.S. seeks a $300 billion investment from TSMC for a massive Arizona fabrication plant, potentially housing future 2nm and 1.4nm processes. This investment, exceeding 30 times TSMC’s equity, follows a prior $165 billion U.S. expansion commitment. TSMC has declined to comment on the rumors.

Tesla has reportedly signed a $16.5 billion deal with Samsung for AI chip manufacturing, intended for electric vehicles and robotics. The agreement focuses on the AI6 chip, potentially utilizing a 2nm process with production in Austin, Texas, starting in 2025. Despite this, Morgan Stanley analysts believe the deal will only minimally impact TSMC’s revenue, estimating a 1% reduction, as TSMC remains a key supplier for Tesla and xAI. TSMC is set to launch its 3nm A15 chip in 2026, while Samsung’s A16 isn’t expected until 2027.

Xiamen Customs intercepted a shipment of calcium fluoride sludge, disguised as industrial material, at Dongdu Port. The substance, a semiconductor manufacturing byproduct, is classified as prohibited foreign waste under Chinese law. Importing foreign waste is illegal, and the shipment will be returned with a fine imposed. Criminal charges may follow. The sludge poses environmental risks like soil and water contamination and health hazards including fluoride toxicity and potential heavy metal exposure, impacting ecosystems and human health.

Infineon Technologies has successfully developed scalable Gallium Nitride (GaN) production on 12-inch wafers, a significant advancement over the current 200mm standard. This technology offers higher power density and efficiency, promising broader applications. The company will begin delivering samples in Q4 2025. Notably, TSMC is exiting the GaN wafer foundry market, leaving Infineon as a key player.