Semiconductor Equipment

Advantest shares surged on record quarterly sales and strong demand for SoC and memory testers, vital for AI and high-performance chips. The company revised its full-year profit forecast upwards, driven by its Test System Business. Despite geopolitical risks, Advantest anticipates continued demand for its testing solutions.

Shanghai Xingshang Micro-Assembly, established in February 2025, has delivered its 500th advanced packaging lithography system, marking a significant achievement for China’s semiconductor equipment industry. Its core product excels in resolution, overlay accuracy, and exposure field. Holding a 35% global market share and a dominant 90% in China, the company’s systems cater to technologies like Flip-chip and 2.5D/3D packaging. The 500th system will be deployed at JCET’s Shenghe Microelectronics, supporting wafer-level packaging for high-performance chips.