CNBC AI News, August 10th – Shanghai Xingshang Micro-Assembly Technology Co., Ltd. (“Xingshang Micro-Assembly”) recently announced the delivery of its 500th stepper lithography system, signaling a new milestone for China’s high-end semiconductor equipment industry.
The advanced packaging lithography system is Xingshang Micro-Assembly’s core product. It stands out with high resolution, superior overlay accuracy, and an extra-large exposure field. Furthermore, its robust capabilities in handling warpage and thick resists, coupled with flexible configuration options tailored to specific customer process requirements, make it a formidable player in the market.
These systems are designed to meet the demands of advanced packaging technologies, including Flip-chip, Fan-in, Fan-out WLP/PLP, and 2.5D/3D, resonating strongly with the market. Xingshang Micro-Assembly boasts a global market share of 35% and a dominant 90% market share within China.
The 500th system is destined for Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) affiliate, Shenghe Microelectronics (Jiangyin) Co., Ltd., a leading global provider of integrated circuit wafer-level advanced packaging and testing services.
These systems will be integrated into Shenghe Microelectronics’ advanced packaging lines supporting wafer-level packaging and testing of high-performance computing chips such as GPUs, CPUs, and AI chips.
According to Xingshang Micro-Assembly’s website, the company, established in February 2025, is an innovative technology enterprise concentrating on the research and development, production, and service of high-end semiconductor equipment.
The company’s technical team comprises approximately 600 members, with an average age of 33, and 65% holding master’s or doctoral degrees.
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