Advanced Packaging

SK Hynix is investing $12.9 billion in a new advanced packaging plant in South Korea to meet soaring AI demand. This facility will produce High-Bandwidth Memory (HBM), crucial for AI processors, enhancing performance and efficiency. The move responds to intense competition and a projected 33% annual growth in the HBM market. This strategic expansion positions SK Hynix to capitalize on the AI revolution, potentially alongside a U.S. stock listing.

Nordson Electronics Solutions will showcase its latest semiconductor manufacturing innovations at SEMICON Taiwan 2025 (September 10-12, booth i2326). They will highlight automated fluid dispensing with the ASYMTEK® Vantage® system, featuring IntelliJet® jet valves for high-volume underfill and sealing applications. Experts will also discuss plasma treatment for impurity removal and surface preparation, bolstering semiconductor package reliability. Nordson’s brands offer solutions for fluid dispensing, conformal coating, plasma treatment, and selective soldering.

Shanghai Xingshang Micro-Assembly, established in February 2025, has delivered its 500th advanced packaging lithography system, marking a significant achievement for China’s semiconductor equipment industry. Its core product excels in resolution, overlay accuracy, and exposure field. Holding a 35% global market share and a dominant 90% in China, the company’s systems cater to technologies like Flip-chip and 2.5D/3D packaging. The 500th system will be deployed at JCET’s Shenghe Microelectronics, supporting wafer-level packaging for high-performance chips.