Stepper Lithography
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500th Stepper Delivered by Shanghai Chipshine Micro in Just Six Months
Shanghai Xingshang Micro-Assembly, established in February 2025, has delivered its 500th advanced packaging lithography system, marking a significant achievement for China’s semiconductor equipment industry. Its core product excels in resolution, overlay accuracy, and exposure field. Holding a 35% global market share and a dominant 90% in China, the company’s systems cater to technologies like Flip-chip and 2.5D/3D packaging. The 500th system will be deployed at JCET’s Shenghe Microelectronics, supporting wafer-level packaging for high-performance chips.
