Semiconductor

  • Jiangsu Times Memory’s Restructuring Fails, Last Chinese 300mm Fab Dies

    Jiangsu Times Core-Tech Semiconductor (AMS), China’s last unfinished 300mm wafer fab, has officially collapsed. The restructuring investor, Huaxinjiejian, defaulted on its obligations, terminating the revival efforts. AMS was declared insolvent, its equity written off. Previous shareholder AMT clarified its exit and continued support for AMS’s remaining procedures. The ambitious project, plagued by debt and operational issues, ultimately failed to restart, marking a significant blow to China’s semiconductor ambitions.

    2025年7月7日
  • Xinaps Launches IPO: Backed by Big Fund, Stars Eye 100B Valuation Growth

    Changxin Technologies (CXMT), a leading Chinese DRAM memory chip manufacturer, has begun its IPO process. Established in 2016, CXMT focuses on DRAM research, development, manufacturing, and sales. The company, valued at 150.8 billion yuan in its latest funding round, has secured significant backing from investors including the National Integrated Circuit Industry Investment Fund, Alibaba, and Tencent. CXMT’s IPO could make it the first “Storage Chip Stock” listed on the A-shares market, boosting domestic chip manufacturing.

    2025年7月7日
  • YMTC Chief Scientist: China’s 3D NAND Flash Technology Achieves Leap from Lagging to Leading

    At Peking University’s 2025 commencement, YMTC Chief Scientist Huo Zongliang urged graduates to pursue foundational research and independent innovation. Reflecting on YMTC’s success in advancing China’s 3D NAND flash memory technology from its beginnings to a leading position, Huo highlighted the importance of perseverance and overcoming challenges. YMTC has achieved significant milestones, including developing China’s first 3D NAND flash memory and introducing proprietary architectures like Xtacking®, demonstrating a commitment to pushing storage technology boundaries.

    2025年7月6日
  • Cheap Memory, Yangtze Memory Dominates US Market

    China’s YMTC has sued Micron Technology in the US, alleging defamation and disinformation. The lawsuit stems from a long-standing rivalry in memory chip manufacturing, exacerbated by YMTC’s innovative “Xtacking” technology and Micron’s alleged attempts to hinder its growth. YMTC claims Micron infringed on its patents, while Micron denies the allegations and accuses YMTC of infringement. The legal battle highlights the intensifying competition and strategic maneuvers within the global semiconductor industry.

    2025年7月6日
  • Qualcomm’s Cristiano Amon: Driving Terminal AI Adoption with Industry Ecosystem Collaboration

    Qualcomm China Chairman Jerry highlighted at the 2025 Gmosemiconsductor Conference how terminal-side AI is revolutionizing the semiconductor industry. He discussed AI becoming the new user interface, driving structural demand for chips, and the critical hardware-software synergy required for on-device AI performance. Jerry also emphasized Qualcomm’s collaboration with China’s ecosystem partners to accelerate AI adoption across smartphones, PCs, and vehicles, recognizing China’s leading role in AI innovation.

    2025年7月4日
  • UMC June 2025 Sales Report

    United Microelectronics Corporation (UMC) exceeded market expectations with strong June 2025 net sales. This robust performance highlights UMC’s resilient operations and strategic position in the dynamic semiconductor market. The foundry giant’s growth, fueled by demand in AI, automotive, and IoT, signals a promising outlook for the second half of 2025.

    2025年7月4日
  • Unigroup Zhanrui, China’s Sole 5G Baseband Developer, Completes IPO Preparation

    UNISOC, a leading Chinese semiconductor firm, has filed for an IPO on Shanghai’s STAR Market. This move signifies a major step towards becoming China’s first publicly listed domestic smartphone chip designer. With extensive expertise in 2G through 5G baseband technology, UNISOC competes with global giants. The company has bolstered its finances through substantial equity rounds and boasts a broad product portfolio serving over 500 brands worldwide. UNISOC aims for world-class status by 2030, driven by innovation and a strong R&D focus.

    2025年6月29日
  • Samsung’s 1.4nm Delayed to 2028, Focusing on 2nm Production

    Samsung has reportedly delayed its 1.4nm test line construction, potentially pushing production rollout to 2028 due to market headwinds and its foundry business’s financial losses. The company is now focusing on its 2nm process, aiming for mass production by year-end, and pursuing orders from top suppliers like Tesla and Qualcomm. They plan to deploy the 2nm process at their new Texas facility.

    2025年6月23日
  • TSMC’s 2nm Yields Exceed 60%, Surpassing Samsung: Apple and NVIDIA Among Customers

    TSMC’s 2nm process has achieved a production yield exceeding 60%, solidifying its leadership in semiconductor manufacturing. This puts them far ahead of Samsung, whose 2nm yield is around 40%. TSMC’s 2nm technology, leveraging GAA, promises significant performance and efficiency gains. Key clients like Apple, NVIDIA, and AMD are expected to adopt it, while Samsung is targeting 2nm production for its Exynos 2600 processor later this year.

    2025年6月16日
  • SK Hynix Crowned New Profit King: Surpasses Samsung with 21.33 Trillion Won Profit Last Year

    SK Hynix surpassed Samsung Electronics in operating profit in 2024, achieving 21.33 trillion won, driven by a strong performance in the memory chip market. South Korea’s 1,000 major listed companies also saw record profits, with a 92.7% increase from 2023. While Samsung had significantly higher revenue, SK Hynix’s operating profit margin was much higher. The CXO Institute predicts SK Hynix to maintain its lead in 2025.

    2025年6月9日