YMTC Chief Scientist: China’s 3D NAND Flash Technology Achieves Leap from Lagging to Leading

At Peking University’s 2025 commencement, YMTC Chief Scientist Huo Zongliang urged graduates to pursue foundational research and independent innovation. Reflecting on YMTC’s success in advancing China’s 3D NAND flash memory technology from its beginnings to a leading position, Huo highlighted the importance of perseverance and overcoming challenges. YMTC has achieved significant milestones, including developing China’s first 3D NAND flash memory and introducing proprietary architectures like Xtacking®, demonstrating a commitment to pushing storage technology boundaries.

CNBC AI News – July 6, 2025 – At the 2025 Peking University graduate commencement ceremony, Yangtze Memory Technologies Corp. (YMTC) Chief Scientist and alumnus Huo Zongliang delivered a speech on behalf of the alumni, offering his congratulations and advice to the graduating class.

Huo Zongliang emphasized Peking University’s enduring mission of national rejuvenation since its inception, stating that the spirit of “serving the country and the world” is deeply ingrained in every北大 (Peking University) graduate. “Our commitment,” he urged, “is to embrace the challenge of long-term, foundational research without the allure of immediate returns, striving diligently on the path of independent innovation.”

Reflecting on his decade at YMTC, Huo described the team’s arduous journey: “For over ten years at YMTC, our team has endured hardship and overcome formidable obstacles. We have successfully transformed China’s 3D NAND flash memory technology from nascent beginnings to a position of leadership and advancement, achieving a leapfrog in development.”

“In any field,” Huo added, “achieving groundbreaking success necessitates a readiness to confront difficulties and a dedication to perseverance.”

Established in July 2016 and headquartered in Wuhan, YMTC is an integrated device manufacturer (IDM) specializing in the design, manufacturing, packaging, testing, and system solutions for memory chips. YMTC stands as a pivotal player in China’s semiconductor industry, driving innovation in storage technology.

In October 2017, YMTC made a significant breakthrough by successfully designing and manufacturing China’s first 3D NAND flash memory, leveraging a strategy of independent R&D combined with international collaboration. By September 2019, the second generation of TLC 3D NAND flash memory, featuring YMTC’s proprietary Xtacking® architecture, officially entered mass production, marking a critical milestone in China’s memory chip capabilities.

The company’s trajectory continued with the announcement in April 2020 of its third-generation TLC/QLC products. The X2-6070 model, in particular, was heralded as the first third-generation QLC flash memory to achieve industry-leading I/O speeds, highest storage density, and largest single-die capacity at the time of its release, underscoring YMTC’s commitment to pushing technological boundaries.

YMTC Chief Scientist: China's 3D Flash Memory Technology Moves from Lagging to Leading

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