Semiconductor

  • AMD Q3 2025 Earnings Report

    AMD’s Q3 results exceeded expectations with $9.25B revenue and $1.20 adjusted EPS. Revenue grew 36% YoY, driven by strong performance across key segments. Q4 revenue is projected at $9.6B, up 25% YoY, with a 54.5% gross margin. The company’s guidance excludes Instinct MI308 chip revenue to China. Strategic partnerships with OpenAI and Oracle, and Amazon’s sale of AMD shares highlight key developments. The company’s success in AI and other key areas intensifies its rivalry with Nvidia.

    21 hours ago
  • Samsung to Automate Chip Production with Massive Nvidia GPU Purchase

    Samsung is investing in a 50,000 Nvidia GPU cluster, dubbed the “AI Megafactory,” to enhance chip manufacturing for mobile devices and robotics. This project signifies the escalating demand for AI acceleration and strengthens Nvidia’s position in the AI revolution. In addition to being a customer, Samsung will leverage Nvidia’s Omniverse and optimize chipmaking lithography. Samsung will also collaborate with Nvidia on HBM4 memory technology for future AI chips. These partnerships support Korea’s ambition to become a global AI leader.

    3 days ago
  • SK Hynix Q3 Profit Surges 62% to Record High, Driven by Nvidia Demand

    SK Hynix reported record revenue and profit driven by soaring demand for its high bandwidth memory (HBM) solutions crucial for generative AI. The company’s HBM focus has made it a key player in the AI infrastructure market, with its 2026 memory product supply already fully committed. Revenue increased 39% and operating profit 62% year-over-year in Q3. SK Hynix aims to maintain its HBM leadership, supplying next-gen HBM4 chips. While competitors like Micron and Samsung are entering the HBM market, analysts project SK Hynix will preserve its dominant share throughout 2025.

    2025年11月13日
  • TSMC Profit Soars 39% on AI Chip Demand, Exceeding Expectations

    TSMC reported a strong Q3, driven by the thriving AI chip market. Profit surged 39.1% year-over-year, with revenue exceeding expectations at NT$989.92 billion. Net income also surpassed estimates, reaching NT$452.3 billion. The company’s HPC division, fueled by AI and 5G infrastructure demands, was a key growth driver. Advanced chips using 7-nanometer or smaller technologies comprised 74% of wafer revenue, highlighting TSMC’s technological lead in miniaturization. TSMC’s performance underscores its critical role in the global semiconductor supply chain and the AI revolution.

    2025年10月18日
  • A European Company’s Role in U.S.-China Trade Tensions

    Amid escalating U.S.-China trade tensions, ASML, a Dutch lithography systems manufacturer, is a key player. U.S. export restrictions, mirrored by Dutch licensing, limit China’s access to ASML’s advanced EUV technology, crucial for cutting-edge chip production. ASML anticipates a sales decline to Chinese customers. This impacts China’s semiconductor development, hindering its ability to compete with the U.S. Access to advanced semiconductors is vital, representing a critical fault line in the U.S.-China relationship, with implications for the global economic and geopolitical landscape.

    2025年10月18日
  • ASML Q3 Earnings

    ASML anticipates a significant decline in China sales for 2026, despite overall net sales projected to match or exceed 2025 levels. This guidance follows concerns about ASML’s growth trajectory. While Q3 net sales fell short of expectations, net profit slightly beat estimates. Geopolitical tensions and export restrictions impact ASML, but analysts remain bullish, citing AI chip foundry expansion and China’s semiconductor efforts as long-term growth drivers. Stronger smartphone/PC sales and AI-driven memory growth also favor ASML.

    2025年10月17日
  • Kulicke & Soffa Announces Retirement of EVP & GM, K&S Products & Solutions

    Kulicke & Soffa (K&S) announced the retirement of Chan Pin Chong, EVP & GM of K&S Products & Solutions, effective December 1, 2025. Simultaneously, Ivy Qin and John Molnar, VPs & GMs of Wire Bonding and Advanced Solutions respectively, have been promoted to report directly to CEO Fusen Chen. This organizational restructuring emphasizes agility in the semiconductor market and leverages internal talent to drive growth. The experienced Qin and Molnar will be crucial in navigating technological advancements and global demands in semiconductor manufacturing.

    2025年10月17日
  • Chip stocks bounce on Broadcom-OpenAI deal, easing China tensions

    Semiconductor stocks rebounded strongly, spurred by OpenAI’s custom AI chip deal with Broadcom and signals of easing US-China tensions. Broadcom shares surged 10% on the news, while the VanEck Semiconductor ETF (SMH) jumped 4%. Nvidia, Taiwan Semiconductor (TSM), and Micron Technology saw significant gains. The rally reversed Friday’s losses driven by tariff concerns, with Trump alleviating anxieties regarding US-China relations. The OpenAI-Broadcom deal underscores the increasing demand for specialized AI hardware, reshaping the semiconductor landscape.

    2025年10月15日
  • China Blacklists Chip Research Firm After Huawei Report

    China has banned semiconductor research firm TechInsights, citing national security, from engaging with Chinese entities amid scrutiny of its chip industry. This action, following TechInsights’ report on Huawei’s AI chips revealing reliance on foreign components, raises concerns about transparency in China’s semiconductor advancements and its goal of self-sufficiency. The ban is seen as an attempt to control the narrative surrounding China’s chipmaking progress, especially as it aims to challenge US dominance in AI chips. Huawei’s reliance on international suppliers, despite US restrictions, adds complexity.

    2025年10月11日
  • Applied Materials Launches New Chipmaking Solutions for AI Performance Boost

    Applied Materials (AMAT) introduced new chipmaking systems on Oct 7, 2025, designed to enhance AI chip performance. These include the Kinex™ bonding system for advanced logic and memory, the Xtera™ Epi system for Gate-All-Around transistors, and the PROVision™ 10 eBeam metrology system for improved yield in 3D chips. These innovations address critical areas like logic, DRAM, and advanced packaging, aiming to deliver performance and power-efficiency improvements needed to scale AI.

    2025年10月7日