Qualcomm Showcases Connectivity and Innovation at Chain Expo for Third Consecutive Year

At the third China International Supply Chain Expo (CISCE), held in Beijing from July 16-20, Qualcomm showcased its 40 years of relentless innovation under the theme “40 Years of Unwavering Innovation: Achieving Progress for Everyone, Together.” The San Diego-based chip giant highlighted breakthrough advancements and collaborative achievements in pivotal areas including 5G Advanced (5G-A), on-device Artificial Intelligence (AI), smartphones, personal computers (PCs), automotive, extended reality (XR), and the Internet of Things (IoT). Attendees experienced firsthand how Qualcomm’s technological prowess and strategic partnerships are accelerating digital transformation and propelling the industry forward.

Qualcomm’s booth at the third China International Supply Chain Expo

Qian Kun, Senior Vice President of Qualcomm Global, attended the CISCE opening ceremony, stating, “As a participant in the CISCE for three consecutive years, Qualcomm anticipates that this platform will continue to promote cross-industry and cross-regional synergistic development of the industrial ecosystem. 2025 marks Qualcomm’s 40th anniversary and the 30th anniversary of its entry into China, an important milestone. With 5G-A and on-device AI technologies as pillars, Qualcomm will deepen its collaboration with Chinese partners to jointly create a new future of intelligent connectivity.” Qualcomm Global Vice President Xia Quan and Qualcomm Global Vice President Hou Mingjuan also participated in forums held concurrently with the expo.

40 Years of Mobile and Computing Innovation, 30 Years of Collaborative Intelligent Connectivity

Qualcomm boasts deep-rooted technological advantages in the mobile connectivity landscape. Over the past three decades, Qualcomm has advanced alongside its Chinese telecommunications partners, playing a pivotal role in the evolution from 3G and 4G to the present 5G Advanced era, making significant contributions to the development of the industrial ecosystem.

Qualcomm and its Chinese partners share three decades of mobile communications innovation

At the CISCE, Qualcomm showcased its decades-long journey alongside Chinese operators, jointly propelling the development of mobile communication in China. This exhibition highlighted the deepening cooperation and the resulting progress in driving the evolution of communication technology, especially towards the 5G-A era of multi-gigabit speeds and enhanced capabilities. At this year’s CISCE, Qualcomm, through its “Wireless Reach” program, collaborated with China International Exhibition Center Group Co., Ltd., Beijing Unicom, T&W Communication (Shanghai) Co., Ltd., and Quectel Wireless Solutions to provide 5G-A multi-gigabit network service guarantee for the E4 hall.

This network leverages the 26GHz high-frequency spectrum, featuring an ultra-large total bandwidth of 800MHz, aggregated from four 200MHz carriers. This infrastructure facilitates multiple high-definition video live streams and immersive interactive demonstrations, while converting the 5G-A signal into widely compatible Wi-Fi, achieving seamless Wi-Fi coverage across the venue. This offers robust support for high-throughput business requirements in large venues, ensuring a smoother and more convenient experience for all attendees. The 5G-A multi-gigabit network not only meets the demands of the exhibition but also possesses the capability to support future applications such as the industrial Internet, XR, and glasses-free 3D, laying a solid network foundation for multi-gigabit access, edge computing, and smart manufacturing scenarios.

As a core element of the digital economy, 5G-A not only delivers a superior network connectivity experience to consumers, thereby opening up a broader landscape for digital consumption and entertainment, but also provides robust and reliable technical support for the in-depth development of more enterprise and industrial applications. Looking ahead, Qualcomm, together with its industry partners, will advance the industry towards 6G, leading the next generation of wireless connectivity technology and unlocking the future potential of intelligent interconnection.

Building a Broad Ecosystem for On-Device AI, Opening New Spaces for Development

The deployment of on-device AI is emerging as a critical trend in digital innovation. Qualcomm, as a leader in on-device AI, is collaborating with numerous Chinese ecosystem partners to deploy on-device AI applications to a wide range of devices, including smartphones, automobiles, XR headsets and glasses, PCs, and industrial IoT terminals, unlocking new opportunities for AI development.

Currently, over 3 billion users worldwide utilize Snapdragon-powered devices. At the CISCE, Qualcomm centrally displayed a broad array of Snapdragon-powered smart devices, including Smartphones, PCs, XR terminals, and wearables. Showcased were 12 flagship smartphones from Chinese brands, all built on the Snapdragon 8 Gen 3 Mobile Platform. The diverse applications of generative AI drew crowds eager to experience firsthand.

Smartphones powered by the Snapdragon 8 Gen 3 Mobile Platform take center stage

Beyond smartphones, a range of consumer electronic products capable of running generative AI locally were also on display, providing visitors with tangible and compelling on-device AI experiences. ASUS and Lenovo AI PCs also featured, showcasing impressive AI capabilities supported by the Snapdragon X Series platforms. Notably, the ASUS AI PC powered by the Snapdragon X Elite platform demonstrated a groundbreaking innovation in 4K 120fps VVC (H.266) ultra-high-definition video playback, highlighting Qualcomm’s deep collaboration with industry partners and the innovative potential of AI PCs in the realm of audio-visual entertainment. Currently, Qualcomm’s ecosystem partners have released more than 85 AI PC devices based on the Snapdragon X Series platforms, a number projected to exceed 100 by next year.

Attendees experience immersive gaming powered by the Snapdragon XR2 Platform

AI is also reshaping immersive digital experiences. Qualcomm presented four XR terminals from Xiaomi, RayNeo, INMO, and PICO respectively, leading visitors to sample new horizons in on-device AI. These included Xiaomi’s just-released AI Smart Glasses, powered by the Snapdragon AR1 Platform Gen 1, and the PICO 4 Ultra, powered by the Snapdragon XR2 Platform. The PICO 4 Ultra boasts powerful spatial computing capabilities, supporting dual 4K resolution and 32-megapixel high-definition binocular cameras for accurate motion capture. A bespoke MR experience developed by PICO for this device, “Da Vinci: Wings of Genius,” allowed visitors to travel through time to disassemble a “mechanical lion,” repair a “flying machine,” and even soar above Florence, Italy, creating a fully immersive interactive experience.

Venturing into More Domains: Empowering Innovation in Intelligent Vehicles and the IoT Industry

On display at the Qualcomm booth was Li Auto’s flagship family tech MPV, the Li MEGA, attracting significant attention. As a vehicle powered by the 4th Generation Snapdragon Cockpit Platform, its powerful graphics processing capabilities and local AI computing power provide smooth and collaborative support for navigation, multimedia, voice interaction, vehicle condition monitoring, and other systems, delivering a responsive and natural in-vehicle interactive experience.

The Snapdragon Digital Cockpit Platform supports Li MEGA in creating a new intelligent driving experience.

For years, Qualcomm has leveraged “connectivity + computing + AI” as the core, driving the transition of automobiles from “mechanical engineering products” to “intelligent mobile terminals” through the Snapdragon Digital Chassis solutions. Since 2023, the Snapdragon Digital Chassis solution has supported the launch of over 210 models by numerous Chinese automotive brands, covering diverse needs ranging from high-end luxury to the mass market, continuously advancing the intelligentization of the automotive industry.

The Qualcomm QET1100 Platform empowers intelligent bionic hand palms, enabling precise gesture recognition and interaction

From smart cockpits to the Internet of Everything, Qualcomm also showcased the Qualcomm QET1100 product brand, designed for the enterprise market. As a complete product portfolio for intelligent edge computing, the Qualcomm QET1100 encompasses not only hardware but also software and services, delivering cutting-edge edge AI, high-performance, low-power computing, and exceptional connectivity. The exhibition area highlighted Qualcomm’s collaborative achievements with Chinese IoT manufacturers in various vertical domains, including innovative applications in robotics, industry, agriculture, and retail. These displays demonstrated Qualcomm’s commitment to helping partners build globally competitive products and solutions, accelerating innovation, and expanding into global markets.

Qualcomm Global Vice President Hou Mingjuan delivers a speech at the CCPIT Think Tank Exchange Event and the Global Supply Chain Report and Index Release Conference.

Participating in the CISCE for the third consecutive year, Qualcomm continues to showcase its innovative achievements and collaborative potential in multiple fields with Chinese partners through cutting-edge technologies such as 5G-A and on-device AI. Addressing the CCPIT Think Tank Exchange Event and the Global Supply Chain Report and Index Release Conference, Hou Mingjuan stated that open cooperation in the global industrial chain is crucial for Qualcomm’s development, bringing opportunities for Qualcomm’s business development in areas such as smartphones, intelligent vehicles, and AI glasses. Moving forward, Qualcomm will continue to deepen its collaboration with industrial ecosystem partners, achieving deep integration of technological innovation and industrial application and jointly creating a new future of intelligent interconnection.