Semiconductor

NVIDIA quietly added InnoScience, a Chinese GaN manufacturer, to its list of 800V DC power architecture partners, making it the sole Chinese supplier. This triggered a surge in InnoScience’s stock price in Hong Kong. InnoScience confirmed the collaboration, noting its GaN technology’s role, but cautioned that it’s still in the testing phase without concrete orders. InnoScience, the world’s first IDM mass-producing 8-inch GaN wafers, leads in GaN discrete device shipments, serving various sectors, including EVs and data centers.

PDF Solutions (PDFS) will release its Q2 fiscal 2025 financial results on August 7, 2025, after market close. A conference call, hosted by CEO John Kibarian and CFO Adnan Raza, will be held the same day at 2:00 PM PT / 5:00 PM ET. Investors can pre-register for the call or access it via webcast on the company’s investor relations website. A replay will be available. PDF Solutions provides data solutions for the semiconductor industry, focusing on improving yield, quality, and efficiency.

Jiangsu Times Core-Tech Semiconductor (AMS), China’s last unfinished 300mm wafer fab, has officially collapsed. The restructuring investor, Huaxinjiejian, defaulted on its obligations, terminating the revival efforts. AMS was declared insolvent, its equity written off. Previous shareholder AMT clarified its exit and continued support for AMS’s remaining procedures. The ambitious project, plagued by debt and operational issues, ultimately failed to restart, marking a significant blow to China’s semiconductor ambitions.

Changxin Technologies (CXMT), a leading Chinese DRAM memory chip manufacturer, has begun its IPO process. Established in 2016, CXMT focuses on DRAM research, development, manufacturing, and sales. The company, valued at 150.8 billion yuan in its latest funding round, has secured significant backing from investors including the National Integrated Circuit Industry Investment Fund, Alibaba, and Tencent. CXMT’s IPO could make it the first “Storage Chip Stock” listed on the A-shares market, boosting domestic chip manufacturing.

At Peking University’s 2025 commencement, YMTC Chief Scientist Huo Zongliang urged graduates to pursue foundational research and independent innovation. Reflecting on YMTC’s success in advancing China’s 3D NAND flash memory technology from its beginnings to a leading position, Huo highlighted the importance of perseverance and overcoming challenges. YMTC has achieved significant milestones, including developing China’s first 3D NAND flash memory and introducing proprietary architectures like Xtacking®, demonstrating a commitment to pushing storage technology boundaries.

China’s YMTC has sued Micron Technology in the US, alleging defamation and disinformation. The lawsuit stems from a long-standing rivalry in memory chip manufacturing, exacerbated by YMTC’s innovative “Xtacking” technology and Micron’s alleged attempts to hinder its growth. YMTC claims Micron infringed on its patents, while Micron denies the allegations and accuses YMTC of infringement. The legal battle highlights the intensifying competition and strategic maneuvers within the global semiconductor industry.

Qualcomm China Chairman Jerry highlighted at the 2025 Gmosemiconsductor Conference how terminal-side AI is revolutionizing the semiconductor industry. He discussed AI becoming the new user interface, driving structural demand for chips, and the critical hardware-software synergy required for on-device AI performance. Jerry also emphasized Qualcomm’s collaboration with China’s ecosystem partners to accelerate AI adoption across smartphones, PCs, and vehicles, recognizing China’s leading role in AI innovation.

United Microelectronics Corporation (UMC) exceeded market expectations with strong June 2025 net sales. This robust performance highlights UMC’s resilient operations and strategic position in the dynamic semiconductor market. The foundry giant’s growth, fueled by demand in AI, automotive, and IoT, signals a promising outlook for the second half of 2025.

UNISOC, a leading Chinese semiconductor firm, has filed for an IPO on Shanghai’s STAR Market. This move signifies a major step towards becoming China’s first publicly listed domestic smartphone chip designer. With extensive expertise in 2G through 5G baseband technology, UNISOC competes with global giants. The company has bolstered its finances through substantial equity rounds and boasts a broad product portfolio serving over 500 brands worldwide. UNISOC aims for world-class status by 2030, driven by innovation and a strong R&D focus.

Samsung has reportedly delayed its 1.4nm test line construction, potentially pushing production rollout to 2028 due to market headwinds and its foundry business’s financial losses. The company is now focusing on its 2nm process, aiming for mass production by year-end, and pursuing orders from top suppliers like Tesla and Qualcomm. They plan to deploy the 2nm process at their new Texas facility.