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In a blow to the South Korean tech giant, sources report that Samsung’s 12-layer HBM3E memory is still awaiting certification from NVIDIA, with the timeline now pushed back, potentially to Q4 2025.
High Bandwidth Memory (HBM3E) is a critical component for high-performance computing and AI accelerators, and Samsung’s 12-Hi iteration, offering enhanced performance and capacity, has been facing significant technical hurdles.
The delay marks a further setback for Samsung, which previously aimed for certification by June 2025, a date that was subsequently revised to July, then August. Now, the certification process is anticipated to stretch into the fourth quarter of next year.
This delay could have ripple effects throughout Samsung’s market strategy, as NVIDIA is a primary customer for HBM3E. Failure to secure timely certification could lead to inventory backlog and lost revenue opportunities.
Furthermore, NVIDIA has recently tightened its testing standards for HBM memory, which may be contributing to Samsung’s certification difficulties.
Meanwhile, Samsung’s key competitors, Micron and SK Hynix, are aggressively vying for market share in the HBM3E arena.
Micron has already stated that its HBM3E 12Hi memory will be supplying NVIDIA’s GB300 project in the latter half of 2025. If Samsung’s certification continues to be delayed, Micron stands to gain a significant competitive edge, further consolidating its position in the lucrative HBM3E market.
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